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June 1996
NDP7061L / NDB7061L N-Channel Logic Level Enhancement Mode Field Effect Transistor
General Description
These logic level N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage applications such as automotive, DC/DC converters, PWM motor controls, and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.
Features
60 A, 60 V. RDS(ON) = 0.018 @ VGS= 5 V RDS(ON) = 0.013 @ VGS= 10 V. Low drive requirements allowing operation directly from logic drivers. VGS(TH) < 2.0V. Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor. 175C maximum junction temperature rating. High density cell design for extremely low RDS(ON). TO-220 and TO-263 (D2PAK) package for both through hole and surface mount applications.
________________________________________________________________________________
D
G
S
Absolute Maximum Ratings
Symbol VDSS VDGR VGSS ID Parameter Drain-Source Voltage
T C = 25C unless otherwise noted
NDP7061L 60 60 16 25 60 180 130 0.87 -65 to 175
NDB7061L
Units V V V
Drain-Gate Voltage (RGS < 1 M) Gate-Source Voltage - Continuous - Nonrepetitive (tP < 50 s) Drain Current - Continuous - Pulsed
A
PD
Maximum Power Dissipation @ TC = 25C Derate above 25C
W W/C C
TJ,TSTG
Operating and Storage Temperature Range
(c) 1997 Fairchild Semiconductor Corporation
NDP7061L Rev.C1
Electrical Characteristics (TC = 25C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units DRAIN-SOURCE AVALANCHE RATINGS (Note 1) W DSS IAR BVDSS IDSS IGSSF IGSSR VGS(th) RDS(ON) Single Pulse Drain-Source Avalanche Energy VDD = 30 V, ID =60 A 500 60 mJ A
Maximum Drain-Source Avalanche Current
OFF CHARACTERISTICS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current VGS = 0 V, ID = 250 A VDS = 48 V, VGS = 0 V TJ = 125C Gate - Body Leakage, Forward Gate - Body Leakage, Reverse VGS = 16 V, VDS = 0 V VGS = -16 V, VDS = 0 V VDS = VGS, ID = 250 A TJ = 125C Static Drain-Source On-Resistance VGS = 5 V, ID = 30 A TJ = 125C VGS = 10 V, ID = 30 A ID(on) gFS On-State Drain Current Forward Transconductance VGS = 5 V, VDS = 10 V VDS = 10 V, ID = 30 A VDS = 30 V, VGS = 0 V, f = 1.0 MHz 60 45 1 0.65 1.2 0.7 0.013 0.023 0.011 60 10 1 100 -100 V A mA nA nA
ON CHARACTERISTICS (Note 1) Gate Threshold Voltage 2 1.5 0.018 0.032 0.013 A S V
DYNAMIC CHARACTERISTICS
Ciss Coss Crss
tD(on) tr tD(off) tf Qg Qgs Qgd
Input Capacitance Output Capacitance Reverse Transfer Capacitance
2600 690 220
pF pF pF
SWITCHING CHARACTERISTICS (Note 1) Turn - On Delay Time Turn - On Rise Time Turn - Off Delay Time Turn - Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS= 12 V ID = 60 A , VGS = 5 V VDD = 30 V, ID = 60A, VGS = 5 V, RGEN = 10 RGS = 10 18 430 63 240 52 9 28 35 600 120 400 75 nS nS nS nS nC nC nC
NDP7061L Rev.C1
Electrical Characteristics (TC = 25C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units DRAIN-SOURCE DIODE CHARACTERISTICS IS ISM VSD Maximum Continuos Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VGS = 0 V, IS = 30 A (Note 1) TJ = 125C trr Irr Reverse Recovery Time Reverse Recovery Current VGS = 0 V, IF = 60A, dIF/dt = 100 A/s 40 2 0.9 0.8 60 180 1.3 1.2 150 10 A A V V ns A
THERMAL CHARACTERISTICS RJC RJA Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient 1.15 62.5 C/W C/W
Note: 1. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%.
NDP7061L Rev.C1
Typical Electrical Characteristics
100 I D , DRAIN-SOURCE CURRENT (A)
4.5 4.0
R DS(on), NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
80
V = 10V GS 6.0 5.0
2 1.8 1.6 1.4 1.2 1 0.8
3.5
60
VGS =3.0V 3.5 4.0 4.5 5.0 6.0 10
3.0
40
20
2.5
0
0
1 V
DS
2 3 , DRAIN-SOURCE VOLTAGE (V)
4
5
0.6
0
20
40 60 I D , DRAIN CURRENT (A)
80
100
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
2.25
2 R DS(on) , NORMALIZED DRAIN-SOURCE ON-RESISTANCE
R DS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE
2 1.75 1.5 1.25 1 0.75 0.5 0.25 -50
I D = 30A VGS = 10V
V
1.8 1.6 1.4 1.2 1 0.8 0.6
GS
= 5V T = 125C J
25C
-55C
-25
0
25 50 75 100 T , JUNCTION TEMPERATURE (C) J
125
150
175
0.4
0
20
40 60 I , DRAIN CURRENT (A)
D
80
100
Figure 3. On-Resistance Variation with Temperature.
Figure 4. On-Resistance Variation with Drain Current and Temperature.
GATE-SOURCE THRESHOLD VOLTAGE
60
1.4 1.2 1 0.8 0.6 0.4 0.2 -50
VDS = 10V
50 I D , DRAIN CURRENT (A)
T = -55C J 125C
25C
VGS(th) , NORMALIZED
VDS = V GS I D = 250A
40
30
20
10
0
0
1 V
GS
2 3 , GATE TO SOURCE VOLTAGE (V)
4
-25
0
25 50 75 100 T , JUNCTION TEMPERATURE (C)
J
125
150
175
Figure 5. Transfer Characteristics.
Figure 6. Gate Threshold Variation with Temperature.
NDP7061L Rev.C1
Typical Electrical Characteristics (continued)
BV DSS , NORMALIZED DRAIN-SOURCE BREAKDOWN VOLTAGE 1.15
I , REVERSE DRAIN CURRENT (A) 60
I D = 250A
1.1
20 5 1
VGS = 0V TJ = 125C 25C
1.05
0.1
-55C
0.01
1
S
0.95
0.001
0.0001
0.9 -50
0
0.2
-25
0
25 50 75 100 125 T J , JUNCTION TEMPERATURE (C)
150
175
0.4 0.6 0.8 1 VSD , BODY DIODE FORWARD VOLTAGE (V)
1.2
Figure 7. Breakdown Voltage Variation with Temperature.
Figure 8. Body Diode Forward Voltage Variation with Current and Temperature.
5000 , GATE-SOURCE VOLTAGE (V) 3000 CAPACITANCE (pF) 2000
10
I D =60A
8
Ciss
V DS = 12V 24V 48V
1000
Coss
6
500 300 200
4
Crss f = 1 MHz V GS = 0V
1 2 V 5 10 20 , DRAIN TO SOURCE VOLTAGE (V) 30 50 60
GS
2
V 0
DS
100
0
20
40 60 Q g , GATE CHARGE (nC)
80
100
Figure 9. Capacitance Characteristics.
Figure 10. Gate Charge Characteristics.
VDD VIN
D
ton
to f f tr
90%
RL V OUT
t d(on)
t d(off)
90%
tf
VGEN
R GEN RGS
VO U T
G DUT
10% 10%
INVERTED
90%
S
V IN
10%
50%
50%
PULSE W IDTH
Figure 11. Switching Test Circuit.
Figure 12. Switching Waveforms.
NDP7061L Rev.C1
Typical Electrical Characteristics (continued)
, TRANSCONDUCTANCE (SIEMENS)
80
300
VDS =10V
60 ID , DRAIN CURRENT (A)
TJ = -55C 25C
100 50 20 10 5 2 1
N) (O
10 10 s 0 s
it Lim R DS
40
10 10 ms 0m DC s
1m s
125C
20
VGS = 10V SINGLE PULSE RJC =1.15o C/W TC = 25C
0.2 0.5 1 5 10 VDS , DRAIN-SOURCE VOLTAGE (V)) 30 60 100
g
FS
0
0
10
20 30 40 ID , DRAIN CURRENT (A)
50
60
0.5 0.1
Figure 13. Transconductance Variation with Drain Current and Temperature.
Figure 14. Maximum Safe Operating Area.
1 TRANSIENT THERMAL RESISTANCE 0.5 0.3 0.2 0.1
0.05 0.2 0.1 P(pk) D = 0.5
r(t), NORMALIZED EFFECTIVE
R JC (t) =r(t) * R JC RJC = 1.15 C/ W
0.05 0.03 0.02
0.02 0.01 Single Pulse
t1
t2
TJ - TC = P * RJC (t) Duty Cycle, D =t1 / t 2
0.1 0.5 1 5 t 1,TIME (ms) 10 50 100 500 1000
0.01 0.01
0.05
Figure 15. Transient Thermal Response Curve.
NDP7061L Rev.C1
TO-220 Tape and Reel Data and Package Dimensions
TO-220 Tube Packing Configuration: Figur e 1.0
Packaging Description:
TO-220 parts are ship ped normally in tube. The tube is made of PVC plastic treated with anti -stati c agent.These tubes in standard option are placed inside a dissipative plastic bag, barcode labeled, and placed inside a box made of recyclable corrugated pa per. One box contains two ba gs maximum (see fig. 1.0). And one or several o f these boxes are placed inside a labeled shipp ing bo x whic h c omes in different sizes dependi ng on the nu mber of parts ship ped. The other option comes in bulk as described in the Packagin g Information table. The unit s in this option are placed inside a small box laid w ith antistatic bubble sheet. These smaller boxes are individually labeled and placed ins ide a larger box (see fig. 3.0). These larger or intermediate boxes then will b e placed finally inside a labeled shipping box whic h still comes in different sizes depending on the number of units shipped.
45 unit s per Tube
12 Tubes per Bag
2 bag s per Box Conduct ive Plasti c B ag
530mm x 130mm x 83mm Intermediate box
TO-220 Packaging Information: Figure 2.0
TO-220 Packaging Information Packaging Option Packaging type Qty per Tube/Box Box Dimension (mm) Max qty per Box Weight per unit (gm) Note/Comments Standard
(no f l ow code )
FSCINT Labe l samp le
FAIRCHILD SEMICONDUCTOR CORPORATION
1080 uni ts maxi mum quant it y per bo x
S62Z BULK 300
LOT:
CBVK741B019
QTY:
HTB:B 1080
NSID:
FDP7060
SPEC:
Rail/Tube 45 530x130x83 1,080 1.4378
D/C1:
D9842
SPEC REV: QA REV:
B2
114x102x51 1,500 1.4378
FSCINT Label
(FSCINT)
TO-220 bulk Packing Configuration: Figure 3.0
FSCINT Label An ti-stati c Bubbl e Sheet s 530mm x 130mm x 83mm Intermediate box
1500 uni ts maxi mum quant it y per intermediate box 300 units per EO70 box 114mm x 102mm x 51mm EO70 Immed iate Box 5 EO70 boxe s per per Interm ediate Bo x
FSCINT Label
TO-220 Tube Configuration: Figure 4.0
Note: All dim ensions are in inches
0.123 +0.001 -0.003
0.165 0.080 0.450 .030 1.300 .015 0.032 .003 0.275
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
0.160
20.000 +0.031 -0.065
0.800 0.275
August 1999, Rev. B
TO-220 Tape and Reel Data and Package Dimensions, continued
TO-220 (FS PKG Code 37)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 1.4378
September 1998, Rev. A
TO-263AB/D2PAK Tape and Reel Data and Package Dimensions
TO-263AB/D2PAK Packaging Configuration: Figure 1.0
Packaging Description:
EL ECT ROST AT IC SEN SIT IVE DEVICES
DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S
TNR D ATE PT NUMB ER PEEL STREN GTH MIN ___ __ ____ __ ___gms MAX ___ ___ ___ ___ _ gms
Antistatic Cover Tape
ESD Label
TO-263/D2PAK parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 800 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled, dry packed, and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains one reel maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped.
CAUTION
Static Dissipative Embossed Carrier Tape Moisture Sensitive Label F63TNR Label Customized Label
TO-263AB/D2PAK Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel Note/Comments Standard (no flow code) TNR 800 13" Dia 359x359x57 800 1.4378 1.6050 L86Z Rail/Tube 45 530x130x83 1,080 1.4378 -
TO-263AB/D2PAK Unit Orientation
359mm x 359mm x 57mm Standard Intermediate box ESD Label
F63TNR Label sample
F63TNR Label
LOT: CBVK741B019 FSID: FDB6320L QTY: 800 SPEC:
DRYPACK Bag
(F63TNR)3
D/C1: D9842 D/C2:
QTY1: QTY2:
SPEC REV: CPN: N/F: F
TO-263AB/D2PAK Tape Leader and Trailer Configuration: Figure 2.0
Carrier Tape Cover Tape
Components Trailer Tape 400mm minimum or 25 empty pockets Leader Tape 1520mm minimum or 95 empty pockets
September 1999, Rev. B
F9835 FDB603AL
F9835 FDB603AL
F9835 FDB603AL
F9835 FDB603AL
Moisture Sensitive Label
TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued
TO-263AB/D2PAK Embossed Carrier Tape Configuration: Figure 3.0 P0
T E1
D0
F K0 Wc B0 E2 W
Tc A0 P1 D1
User Direction of Feed
Dimensions are in millimeter Pkg type TO263AB/ D2PAK (24mm)
A0
10.60 +/-0.10
B0
15.80 +/-0.10
W
24.0 +/-0.3
D0
1.55 +/-0.05
D1
1.60 +/-0.10
E1
1.75 +/-0.10
E2
22.25 min
F
11.50 +/-0.10
P1
16.0 +/-0.1
P0
4.0 +/-0.1
K0
4.90 +/-0.10
T
0.450 +/-0.150
Wc
21.0 +/-0.3
Tc
0.06 +/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C).
10 deg maximum Typical component cavity center line
0.9mm maximum
B0 10 deg maximum component rotation
0.9mm maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0 Sketch B (Top View)
Typical component center line
Sketch C (Top View)
Component lateral movement
TO-263AB/D Figure 4.0
2PAK
Reel Configuration:
Component Rotation
W1 Measured at Hub
Dim A Max
B Min Dim C
Dim A max
Dim N
Dim D min
DETAIL AA See detail AA W3
13" Diameter Option
W2 max Measured at Hub
Dimensions are in inches and millimeters
Tape Size
24mm
Reel Option
13" Dia
Dim A
13.00 330
Dim B
0.059 1.5
Dim C
512 +0.020/-0.008 13 +0.5/-0.2
Dim D
0.795 20.2
Dim N
4.00 100
Dim W1
0.961 +0.078/-0.000 24.4 +2/0
Dim W2
1.197 30.4
Dim W3 (LSL-USL)
0.941 - 0.1.079 23.9 - 27.4
August 1999, Rev. B
TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued
TO-263AB/D2PAK (FS PKG Code 45)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 1.4378
August 1998, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
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DISCLAIMER
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. D

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